INSERT INTO sites(host) VALUES('esi.com') 1045: Access denied for user 'www-data'@'localhost' (using password: NO) esi.com Estimated Worth $233,942 - MYIP.NET Website Information
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Who is esi.com at com.whois-servers.net

Domain Name: ESI.COM

Registry Domain ID: 2534826_DOMAIN_COM-VRSN

Registrar WHOIS Server: whois.networksolutions.com

Registrar URL: http://networksolutions.com

Updated Date: 2017-04-28T18:15:18Z

Creation Date: 1998-07-20T04:00:00Z

Registry Expiry Date: 2019-07-19T04:00:00Z

Registrar: Network Solutions, LLC.

Registrar IANA ID: 2

Registrar Abuse Contact Email: abuse

Registrar Abuse Contact Phone: +1.8003337680

Domain Status: clientTransferProhibited https://icann.org/epp#clientTransferProhibited

Name Server: ns.esi.com

Name Server: ns3.level3.net

Name Server: ns4.level3.net

DNSSEC: unsigned

URL of the ICANN Whois Inaccuracy Complaint Form: https://www.icann.org/wicf/

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Title:ESI > Industrial Laser solutions for materials processing and fabrication.
Description:Industrial laser solutions for materials processing, fabrication and micromachining. PCB processing, semiconductor and component manufacturing, and MLCC manufacturing & test.
Keywords:PCB via drilling, PCB laser processing, materials processing, laser ablation, laser micromachining, micromanufacturing, circuit trim, wafer marking, wafer scribe, laser processing.
Body:
ESI gt; Industrial Laser solutions for materials processing and fabrication.
Home
Knowledge
Thought Leadership
Resources
Solutions
Via Drilling
Via Drilling Overview
Flex Via Drilling
Circuit Packaging
High Density Interconnect
Automation
Semiconductor Manufacturing
Semiconductor Manufacturing Overview
Scribing / Grooving
Memory Repair
Wafer Mark
Laser Processing
Laser Processing Overview
Laser Ablation
Micromachining
Milling
Passive Component Manufacturing
Passive Component Manufacturing Overview
MLCC Testing
Resistor Trimming
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Via Drilling
Via Drilling Overview
Flex Via Drilling
IC Packaging
High Density Interconnect
Semiconductor Manufacturing
Semiconductor Manufacturing Overview
Wafer Scribe
Wafer Mark
Memory Repair
Laser Processing
Laser Processing Overview
Ablation
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Passive Component Manufacturing Overview
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nViant
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RollMaster
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Semiconductor Manufacturing Overview
Scribing/Grooving
Ultrus
Memory Repair
9850TPIR+
Wafer Mark
WaferMark SigmaClean 300
WaferMark SigmaDSC
Laser Processing
Laser Processing Overview
Laser Ablation
NWR193
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NWRFemto UC
MIR 10
Micromachining
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Jade
Lumen
Milling
MicroMill
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Passive Component Manufacturing Overview
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See what it #39;s like to be an ESI customer - contact an ESI Sales Expert today
Knowledge
ESI Insights
Resources
Solutions
Via Drilling
Flex Via Drilling
Circuit Packaging
High Density Interconnect
Automation
Semiconductor Manufacturing
Scribing / Grooving
Memory Repair
Wafer Marking
Laser Processing
Laser Ablation
Micromachining
Milling
Passive Component Manufacturing
MLCC Testing
Resistor Trimming
Wafer Trimming
Tooling and Consumables
Applications
Via Drilling
Flex Via Drilling
IC Packaging
High Density Interconnect
Semiconductor Manufacturing
Wafer Scribe
Wafer Marking
Memory Repair
Laser Processing
Ablation
Cutting
Depaneling
Drilling
Engraving
Marking
Subsurface Marking
Passive Component Manufacturing
MLCC Testing
Resistor Trimming
Wafer Trimming
Products
Via Drilling
Flex Interconnect
GemStone
5335
Flex5335
5335xi
LodeStone
RedStone
Circuit Packaging
CornerStone
High Density Interconnect
nViant
Automation
RollMaster
Semiconductor Manufacturing
Scribing/Grooving
Ultrus
Memory Repair
9850TPIR+
Wafer Marking
SC300
SigmaDSC
HM300
SigmaClean
Laser Processing
Laser Ablation
NWR193
NWR213
NWR266
NWRFemto UC
MIR 10
NWRimage
Micromachining
Garnet
Jade
Lumen
Garnet Depaneling-20
Milling
MicroMill
Passive Component Manufacturing
MLCC Testing
Allegro
Resistor Trimming
LT2200
LT2210
LT3100
LT3110
Wafer Trimming
M350
Tooling and Consumables
Machine Tooling
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Belts
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Contact Us
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ESI has been helping customers drive innovation for 70 years.
How can we help you?
I have a sales question
I need product specifications
I need product support
I have a general request
PRECISION IN MOTION
CO2-based microvia drilling for HDI PCB manufacturers.High quality and high accuracy in an affordable platform.
learn more about nViant
璇疯闂瓻SI 涓枃缃戠珯
浜嗚В鏇村鍏充簬鎴戜滑鍏徃鐨勬縺鍏夌敓浜ц澶.ESI鏈熷緟鍚堜綔, 鎰垮崗鍔╄吹鍏徃浼樺寲浜у搧, 鎺ㄥ姩鍒涙柊,浣垮叾淇濇寔涓栫晫棰嗗厛.
www.laserprocessing.cn
THE NEXT WAVE OF INNOVATION IN HDI
Direct copper patterning using glass as dielectric for printed electronics.
download the ESI Tech Brief
BUILD WHAT #39;S NEXT
Your customers are demanding聽higherprecision, shorter ramp times andmore聽flexible product lines.
get your guide to laser micromachining
PCB Processing Flex-PCB, HDI, Packaging
A via drilling portfolio that includes the most popular line of flex PCB processing systems, a CO2-laser-based system for affordable HDI PCB manufacturing and high-volume low cost-of-ownership solutions for IC packaging.
Semiconductor Solutions Grooving, Dicing, Marking
Wafer processing and memory repair solutions that apply optimized laser technology to maintain high-volume production without sacrificing yield. Even when processing thin wafers or incorporating new materials.
Industrial Machining For A Range of Materials
Cut, drill, weld and engrave on glass, leather, ceramic or metal. Or discover the composition of materials. Laser micromachining and laser ablation systems enable powerful laser processing.
Component Testing MLCC Test, Trim, Tooling
A legacy of leadership that includes the industry standard for high-volume MLCC testing, CircuitTrim鈩 solutions for thick-film and thin-film resistor trimming, and the market-leading laser solution for production wafer trimming.
Precision
Accuracy
World Class
Support
Lower Cost
of Ownership
The System
That Fits
Global
Service
Built
to Last
The world is transforming. ESI is focused on delivering new and innovative micro-manufacturing solutions that empower our customers to build the products that transform lives.
The development of this new technique provides our customers the ability to generate data across the periodic table at detection limits superior to traditional methods in a very cost effective manner.
Jon Landau, Vice President of the Geoanalytical Division, Bureau Veritas Minerals
For industries facing material transformation challenges in production, 聽ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers鈥 processing capabilities beyond the limitations of mechanical.
See what it #39;s like to be an ESI customer - contact an ESI Sales Expert today
Solutions:
Via Drilling
Semiconductor Manufacturing
Laser Processing
Passive Component Manufacturing
Automation
Tooling and Consumables
Support amp; Services:
Support amp; Services
Support Offerings
Support Locations
Compliance Programs
Spare Parts
Policies
Prototype amp; Production Services
Contact Support
Get the Latest Industry News amp; Information
Subscribe to our FREE Email Newsletter
The ESI Newsletter offers valuable insights into developments in laser processes and materials handling, plus all the latest industry news and events. Stay up-to-date with what #39;s happening in the laser manufacturing industry; subscribe today!
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